For microelectronic component level hermetic packages, MCL provides complete encapsulation services including materials design, process development, testing, prototyping and production. Supported processes including both Weld or AuSn solder cover seal, with deliverables exceeding all relevant standards including MIL-STD-883 Test Method 1014 Seal; 2009 External Visual; 1009 Salt Atmosphere; 2012 Lid Seal Void Rejection Criteria and JEDEC JESD9C. MCLs processes are guaranteed for the life of the package and include a $0 license fee for the customer package part number. MCL's Robotic Cover Sealer (RCS), patent pending, is the first fully automated cover seal processor. Whether packages and covers are loaded by human operator or robot, every seal comes out perfect! The RCS is an intelligent machine.